Silicon Processing for the VLSI Era: Process Technology, Second Edition, Vol. 1 ebook

The Second Edition of Volume 1 has been extensively rewritten and brougt up to date. Its length has been increased from 660 to over 900 pages. It contains more than 600 illustrations, 200 problems, and 1000 references (a large fraction from 1996 to 1999 sources). It is written in the same lucid and user-friendly style as the first edition. The following "hot" process technologies are covered in detail. This book also has a full money-back guarantee!

• 300 mm wafers
• Chemical-Mechanical Polishing (CMP)
• Stepper-Scanners
• Copper Interconnects
• Low-k Dielectrics
• Chemically-Amplified (CA) Resists
• Cobalt and Titanium Salicides
• Phase-Shift Masking (PSM)
• High Density Plasma (HDP) Sources
• Optical Proximity Correction (OPC)
• Next Generation Lithography (NGL)
• Ionized Metal Sputtering
• Ozone:TEOS Dielectric Films
• Thin Gate Oxides Off
• Axis Illumination
• Transient Enhanced Diffusion (TED)
• Diffusion Barriers for Cu (Ta, TaN, TiN)
• ARCs (BARCs, TARs)
• Ultra-Low & High-Energy Ion Implantation
• Dual-Damascene Interconnects

Tags: silicon processing for the vlsi era