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In the past few years, System-in-Package (SiP) design has fueled a revolution in the use of modules in wireless devices due its effectiveness in meeting the increasingly demanding requirements for reliability, shielding, performance, size, and cost. Here's the first comprehensive resource on SiP design techniques that offers designers state-of-the-art packaging know-how. Moreover, the book provides numerous examples that illustrate real-world capabilities, constraints, trade-offs, and options at every step. Practitioners get full details on filter location and filter types, as well as other passive circuitry that can be integrated in the package to save cost and space. The book addresses advanced techniques that enable the integration of all wireless functions into one module, and explores emerging technologies that point the way to ever-smaller modules. No other source offers a better, more complete understanding of module design and package option capabilities for the wireless industry. Michael P. Gaynor is RF technical director of the SiP Group at CEL in Wauconda, Illinois. Previously he was a senior staff RF development engineer with Motorola. He holds several patents and has published numerous articles and papers on topics in the field. Tags: system package design and applications |
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